A key goal in manufacturing test is to maximize the quality of parts delivered to customers—ideally, shipping zero defective parts while reducing the cost of testing those parts. The arrival of ...
With small-scale CMOS technology nodes, the probability of physical defects occurring in the device increases. Various defects occur which cannot be detected with the help of conventional Single Stuck ...
ATPG targets faults at IC-gate boundaries, but 50% of defects are located within cells. Learn how cell-aware ATPG and user-defined fault models help to ferret out these hard-to-squash bugs.
Delay-inducing defects are causing increasing concern in the semiconductor industry today, particularly at the leading-edge 130- and 90- nanometer nodes. To effectively test for such defects, the ...
Fault simulation, one of the oldest tools in the EDA industry toolbox, is receiving a serious facelift after it almost faded from existence. In the early days, fault simulation was used to grade the ...
To compete in the fast-growing market for automotive ICs, semiconductor companies need to address new challenges across the entire design flow. To meet the ISO 26262 goal of zero defective parts per ...
Railway infrastructure could be made safer and more reliable using AI, artificial intelligence, according to research ...
Combining these Apps with an emulation environment makes it possible to increase fault coverage, increase production yield, and reduce ATE test time and cost. The design-for-test (DFT) technology was ...