Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution” was published by ...

U.S. lifts EDA export restrictions to China; collusion risk in the IC supply chain; Onto buys materials analysis biz; ...

A new technical paper titled “Analyzing Collusion Threats in the Semiconductor Supply Chain” was published by researchers at ...

AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

A new technical paper titled “Patterned Multi-Wall Nanosheet FETs for Sustainable Scaling: Zero Gate Extension With Minimal ...

AI drives workflow re-evaluation; DFT verification; hybrid control; managing AI coding agents; 3D-IC structural integrity.

The actual effect is transformative: cycle times that once stretched into weeks shrink to days. By combining the intelligent ...

A Hybrid Approach for Efficient Hardware Security Verification” was published by researchers at RPTU Kaiserslautern-Landau and UC San Diego. “We propose FastPath, a hybrid verification methodology ...

A new technical paper (preprint) titled “Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous ...

A technical paper titled “Data-driven power modeling and monitoring via hardware performance counter tracking” was published ...

A new technical paper titled “Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes” was published by ...

Ensuring trusted execution across multiple chiplets and vendors is more complex than in traditional monolithic SoCs.